On March 19, 2024, the China International Semiconductor Packaging and Testing Conference was successfully held in Shanghai. This conference has the theme of "Gathering Cores, Empowering Domestic Products, Advanced Packaging and Testing, and Creating the Future of Cores". This conference brings together semiconductor packaging and testing Top experts, scholars, and outstanding companies in the industry discuss the current development status and future trends of the industry together, and also provide professional audiences with one-stop full industry chain solutions.

With the deepening of the localization process of my country's integrated circuits, the vigorous development of downstream application fields, and the continuous progress of domestic advanced packaging and testing technology, the market space of the semiconductor packaging and testing industry will further expand. Whether the coordinated development of the entire industry chain can be achieved is the key to whether the semiconductor packaging and testing industry can increase output value and achieve major breakthroughs.

A map of the semiconductor industry was released during the conference. From the semiconductor wafer production process ➡ the semiconductor wafer production process ➡ the semiconductor packaging and testing production process involves the material and equipment supply chain of the front, middle and back processes, providing an accurate and rapid basis for the coordinated development of the industry path.

With many years of industry experience, Wiskind has developed a series of special partition systems for dust-free factory environments for users in the electronics industry, using surface-sprayed aluminum alloy profiles as the connection structures of each module. Wall panels and wall panels, wall panels and roof panels, wall panels and doors and windows realize quick and easy assembly, disassembly and modification. The structure is simple and the splicing is reliable, which reduces labor costs and improves construction efficiency. No silicone sealant treatment is required, fully meeting the needs of clean factory partition system transformation in the electronics industry.